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Thursday, May 7, 2009 - 4:40 PM

The Effect of Surface Condition on Bonding Between Single PEEK Splats and Aluminum Substrates

J. Wu, P. R. Munroe, University of New South Wales, Sydney, Australia; B. Withy, Defence Technology Agency, NZDF, Auckland, New Zealand; M. M. Hyland, University of Auckland, Auckland, New Zealand

Aluminium substrates were prepared using various thermal spray processes, including HVOF, HVAF and plasma spray methods using PEEK particles as the spray material. Experimental parameters include surface treatments on the aluminum substrate to vary surface chemistry and roughness and variations in substrate temperature. This study was performed to enhance understanding of bonding mechanisms between the coating and substrate, and how these parameters affect the degree of melting of the splats and wetting of the substrate. Interfacial characterization was carried out on these specimens using SEM, TEM, AFM and FIB microscopy. Further, FIB-based methods were used to generate three-dimensional representations of single PEEK splats on aluminum substrates. It has been shown that surface chemistry, in particular, strongly affects the degree of bonding between the splat and the aluminium substrate.

Summary: Aluminium substrates were prepared using various thermal spray processes, including HVOF, HVAF and plasma spray methods using PEEK particles as the spray material. Experimental parameters include surface treatments on the aluminum substrate to vary surface chemistry and roughness and variations in substrate temperature. This study was performed to enhance understanding of bonding mechanisms between the coating and substrate, and how these parameters affect the degree of melting of the splats and wetting of the substrate. Interfacial characterization was carried out on these specimens using SEM, TEM, AFM and FIB microscopy. Further, FIB-based methods were used to generate three-dimensional representations of single PEEK splats on aluminum substrates. It has been shown that surface chemistry, in particular, strongly affects the degree of bonding between the splat and the aluminium substrate.