M. naim, Praxair Inc., Poughkeepsie, NY

Summary: Semiconductor process chambers use several components in the plasma zone, where they are exposed to corrosion under high voltages and elevated temperatures. Thermal spray offers the advantage of protecting specific components or areas from plasma erosion. The surface properties of chamber liners and other components can be altered to resist plasma erosion and reduce particle generation. Thermal spray coatings are also used for electrostatic chucks. These coatings provide dielectric clamping surfaces that can be charged and discharged rapidly without residual polarization. One unique advantage is anti-arc coverage of critical areas on the electrostatic chucks and chamber components. Examples of electrostatic chucks using thermal spray coatings will be presented.