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Wednesday, June 9, 2004 - 10:30 AM
HTM5.1

Transient Liquid Phase Bonding of High-Temperature Aerospace Materials

W. F. Gale, Auburn University, Auburn, AL

This paper will discuss the issues involved in the joining of high-temperature aerospace materials by the transient liquid phase (TLP) bonding process. The paper will concentrate on the joining of gamma titanium aluminide alloys, but will also touch briefly on other materials, such as nickel-base superalloys. The paper will consider issues related to wettability, microstructural development and structure – property relationships.