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Thursday, May 18, 2006 - 9:30 AM
EMP064.3

Effect of CP Al Cold Spray Deposition on 7075 Substrate

J. E. Barnes, Lockheed Martin Aeronautics, Marietta, GA; V. K. Champagne, U.S. Army Research Laboratory, Aberdeen Proving Ground, MD; D. L. Ballard, Air Force Research Laboratory, Wright-Patterson AFB, OH; T. Eden, B. Shoffner, The Pennsylvania State University, University Park, PA; J. Kleek, Air Force Research Laboratory, Wright Patterson AFB, OH

The objective of this study was to examine how the deposition of a thin layer of Commercially Pure (CP) Al on thin plates of Al-7075 T6 affects the tensile properties of the substrate.  The CP Al was deposited using both Cold Spray and Kinetic Metallization™.  Cold Spray utilizes both He and N2 as the carrier gas and a supersonic nozzle while Kinetic Metallization™ uses only He as the carrier gas and a sonic or friction compensated nozzle.  A test matrix was established to evaluate the coatings applied by both methods.  Characterization of the coatings included microstructural analysis, hardness measurements, and tensile, S-N fatigue and bend tests.  Results of the characterization are presented.

Summary: This presentation will focus on the effects of depositing CP Al on a typical high strength aerospace material, 7075-T6 via two competing processes available on the market today. Variables evaluated include, deposition equipment, carrier medium and post process thermal treatments. The substrate was evaluated by mechanical and metallography. The result was quite interesting as there can be a pronounced effect on the resulting mechanical behavior of the substrate.