A prognosis framework for prediction of electronic power supply system failure based upon material fatigue is presented. The method uses a reliability simulation algorithm which accounts for individual interconnect and overall product reliability scale-up.  The framework is used to evaluate a board with many interconnects, packages, and devices while considering failure interrelationships.  The framework can be used to evaluate non-interconnect fatigue failure modes of electronic circuit boards and digital circuitry. The overall prognosis thrust is based on the fact that most electronic failures are material failures – at the board, at interconnects, within the components (i.e., chips).  Additionally, most electronic power supply failures are due to fatigue and fracture of interconnects due to high electronic loadings for these systems. At the foundation of this framework is probabilistic microstructural fatigue crack initiation and total life prediction software.