R. V. Pulikollu, K. Line, VEXTEC, Brentwood, TN; M. Kayyar, VEXTEC Corporation, Brentwood, TN
Electronic interconnects and solder joints traditionally have been designed using rules of thumb developed from experience. Therefore, the mechanical design of solder joints has not been able to take advantage of optimization because of limitations in analysis methods and in testing.
New OEM support arrangements such as performance based logistics and power-by-the-hour are creating financial incentives for electronics suppliers to develop systems with higher reliability. VEXTEC analysis methodology and microstructure durability analysis capabilities allow the reliable life of electronics to be virtually optimized before design and testing begin. Our studies have shown that through analysis we can determine the changes in the shape of Ball Grid Array (BGA) solder to increase durability life by as much as three times. This will translate into electronic packages with substantially higher life and reduced system maintenance costs for the OEM and system operator.
VEXTEC offers this capability as a service to electronic manufacturing OEMS.
Summary: Electronic component design has not taken advantage of optimization available to other structural design. Models developed by VEXTEC enable the design to create longer life electronic connections through the optimization of solder joint shape.
