An important consideration in copper metal matrix composite (CuMMC) production is the nature of the interface between the matrix and the reinforcement. This often depends on the processing route and since it occurs at high temperature, it is more chemical than mechanical. Understanding the mechanism controlling thermal conductivity of Cu-SiC particulate composite is of considerable current interest for microelectronic and thermo-electronic applications. In this paper, the effect of particle size, volume fraction and processing parameters on the thermal conductivity of Cu-SiC particulate composite produced by non-conventional liquid route is investigated. The development of microstructure suitable for high thermal conductivity and low coefficient of thermal expansion of copper alloy MMC is studied.