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Session 2: Emerging Materials and Processes - Processes I
Location: Room 303 (Dayton Convention Center )
(Please check final room assignments on-site).
Session Description:

1:30 PMCoating and Sealant Removal Using Cold Atmospheric Plasma
2:00 PMCold Spray Technology Update – Process Developments and Industrial Applications
2:30 PMFabrication of Smart Aerospace Materials with Ultrasonic Consolidation
3:00 PMBreak
3:30 PMFlexible Robotic Direct Printing of Aircraft Surface Electronics
4:00 PMSolution Nitriding – a Cost Effective Case Hardening Process
4:30 PMEvaluation of Thermomecanical Processes on Alloy 909 Properties
5:00 PMThe Repair of Cracks in Thermoplastic Matrix Composite Materials by Microwave Heating of Carbon Nanotubes