EMP4.3 Kinetic Metallizationof Polymeric Materials

Wednesday, May 25, 2011: 2:30 PM
Seaside A (Long Beach Convention and Entertainment Center)
Dr. Ralph Tapphorn , Inovati, Santa Barbara, CA
Howard Gabel , Inovati, Santa Barbara, CA
Jeff Galli , Inovati, Santa Barbara, CA
Jeffrey Henness , Inovati, Santa Barbara, CA
Kinetic Metallization™ (KM) process can now be used to deposit thermal plastic polymer materials for dielectric insulators and polymeric coatings. Inovati has successfully demonstrated deposition of Ultemä and PTFEä powders onto various metallic and non-metallic substrates. This technology will enable fabrication and direct write of thick dielectrics for RF antenna systems and other electronic applications. This paper will present the development research conducted to date and results of testing a range of coating materials for various applications.  Methods of loading the thermal plastic polymer powders with various ceramic and ferro-electric materials will be presented to demonstrate how the dielectric properties of these coatings can be tailored to specific application requirements. Targeted markets in the wireless military and commercial communication industry have already been identified with primary customers interested in the Kinetic Metallization™ (KM) process as a new manufacturing tool for direct write of these materials.  Other applications related to thermal and sealant barrier coatings using thermal plastic materials will also be identified and discussed.