Study on Interface Temperature and Plastic Strain During Ultrasonic Consolidation Process and their Influence of on Bonding Strength
A CAFE model is built by combining the thermal-mechanical coupled ANSYS model and the in-house built cellular automat model. Using the built model, the microstructure evolution near the contact interface is obtained, such as recrystallization fraction, mean grain diameter and mean dislocation density. A series of punch tests are designed and conducted for the UC made samples. The punch force and the displacement of the punch pin are collected during the punch tests and the highest value of punch force is used as the bonding strength for the tested sample.
By plotting each case on the temperature - plastic strain coordinate system using the obtained results, each case is represented by a point on the temperature - plastic strain coordinate system. At the same time, the microstructure observation results and the punch tests results are compared between different cases. It is found that points closed to each other have the bond strength level close each other. Increasing the applied load will increase the work hardening effect which will weaken the bond quality. Points on the temperature - plastic strain coordinate system with relatively higher temperature elevation and lower plastic deformation will have higher bond strength level.