New Developments on EBCs & TBCs

Tuesday, May 8, 2018: 8:00 AM-10:00 AM
Tampa 1 (Gaylord Palms Resort )
Dr. Dianying Chen, Oerlikon Metco (US) Inc. and Dr. Rogerio S. Lima, National Research Council of Canada (NRC)
8:00 AM
Influence of Spray Conditions on Silicate Coatings by Suspension Plasma Spray (SPS)
Prof. Kazuhiro OGAWA, Tohoku University; Mr. Ryotaro Yanaoka, Tohoku University; Mr. Takaya Masuda, Fujimi Incorporated; Mr. Kazuto Sato, Fujimi Incorporated
8:20 AM
The Importance of Manufacturing and Spray Process Methods in the Design and Development of Environmental Barrier Coatings:
Mr. Aaron M Pegler, Oerlikon Metco AG; Dr. Gopal Dwivedi, Oerlikon Metco (US) Inc; Mr. Jonathan Gutleber, Oerlikon Metco (US) Inc; Mitchell R Dorfman, Oerlikon Metco (US) Inc; Mr. Dianying Chen, Oerlikon Metco (US) Inc
8:40 AM
Plasma Sprayed Yb2Si2O7 as an example of rare-earth silicate for environmental barrier coatings application: processing effects on coating features
Dr. Eugenio Garcia, Center for Thermal Spray Research, Stony Brook University; Mr. Hwasoo Lee, Stony Brook University; Prof. Sanjay Sampath, Stony Brook University
9:00 AM
Comparative Study of Silicate Coatings Fabricated by SPS and APS
Mr. K. Sato, Fujimi Incorporated; Mr. Takaya Masuda, Fujimi Incorporated; Mr. Ryotaro Yanaoka, Tohoku University; Prof. Kazuhiro OGAWA, Tohoku University
9:20 AM
Effect of YSZ Thickness on the Thermal Cyclic Fatigue Performance of Gadolinium Zirconate/YSZ double layered TBCs
Mr. Satyapal mahade, Department of Engineering Science, University West; Dr. Nicholas Curry, Treibacher Industrie AG; Dr. Nicolaie Markocsan, Department of Engineering Science, University West; Prof. Per Nylen, Department of Engineering Science, University West
9:40 AM
Plasma Spray-Physical Vapor Deposition Processing Effects on the Microstructure and Performance of Environmental Barrier Coatings
Dr. Bryan J. Harder, NASA Glenn Research Center; Dr. Kang N Lee, NASA Glenn Research Center
See more of: Advanced Coatings for the Aerospace Industry (joint symposium with ITSC)
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