Wear-resistant coating technology of high thermal conductivity copper material

Cu materials with excellent thermal conductivity properties are used for components with large temperature differences and for components required for solidification of metals.

It is also widely used as a heat sink because it has excellent heat dissipation characteristics.

In this study, Ni electroplating, NiB electroplating and NiCr laser cladding layers were formed on the surface of high thermal conductivity copper material to compare the properties of the materials.

In order to confirm the high temperature characteristics of the coating layer, the thermal shock characteristics and corrosion characteristics were confirmed in a high temperature atmosphere and the high temperature hardness was also measured.

In the present study, the outliers in the Ni-based plating layer were drastically lowered as the temperature increased, and the wear resistance characteristics were closely related to the results of the high-temperature hardness test as a result of the pin-on-disc test.

In addition, the present study investigated the Kirkendall void phenomenon occurring at the interface between the nickel plated layer and the copper layer, and examined the results of the study.

The NiCr laser cladding layer was observed to have a unique solidification structure and it was observed that chromium carbide or boride phase formed along the grain boundary. Such fine metal structures increase abrasion resistance and cause grain boundary strengthening by fine particles.

In order to ensure wear resistance of a Cu material having excellent thermal conductivity, Ni-based plating and laser cladding can be used.