X-ray analytical approach for the evaluation of sensors for aerospace applications

For sensors, the microelectronic industry utilizes a large variety of fabrication processes to obtain the desired function. Many of these processes influence the material systems by the introduction of strain, lattice and volume defects, and residual stress, which affect the final sensor performance and reliability. The control of the status of the materials in the frame of microfabrication covers a fundamental role in optimizing the process itself and guaranteeing the highest device performance during their lifetime.

Here, we discuss a unique approach combining X-ray micro CT (computed tomography) with HRXRD (high-resolution X-ray diffraction) for a holistic evaluation of the processes involved into the fabrication of sensors. We performed an in-depth analysis of the crystalline order modification by the presence of volumetric defects (cracks and voids), lattice strain, and residual stress. The robustness of our X-ray-based approach, further enhanced by means of SEM (scanning electron microscopy) observation of the sensors, is discussed.