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| Session 4: Electronic Packaging | ||||
| Location: Executive Salon 4 (Crowne Plaza Riverwalk San Antonio) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The electronics industry is in the midst of a significant transition as the traditional Sn-Pb solders are being replaced with Pb-free compositions that will meet the changing environmental regulations occurring in Europe and the Pacific Rim. Besides the replacement of Pb-bearing filler metals with non-Pb-containing counterparts, it has also become necessary to use alternative surface finishes for maintaining solderability. Candidate finishes include Au/Ni and the new immersion Ag coatings. However, Sn-Pb solder joints have not completely disappeared from electronic products. These interconnects will continue to be used in military and satellite applications, where long-term reliability is critical. New methodologies are being developed to predict the behavior of Sn-Pb solder joints for these high-value, high consequence applications that cannot sustain even a single interconnection failure. This session will explore the topics of advanced Pb-free solders, alternative surface finishes, and the steps being taken to more fully understand the reliability of Sn-Pb solder joints, which will remain as the primary interconnection material for high-reliability electronic systems (military and satellite applications). | ||||
| Session Chair: | Mr. Mike Powers Agilent Technologies, Inc., Santa Rosa, CA | |||
| 1:30 PM | BSC4.1 | Active Solder Joining of Thermal Management & Electronic Packaging | ||
| 1:50 PM | BSC4.2 | Microstructural Evolution in Electronic 63Sn-37Pb/Cu Solder Joints | ||
| 2:10 PM | BSC4.3 | The Effects of Long-Term Storage on the Solderability of Immersion Silver Coatings | ||
| 2:30 PM | BSC4.4 | Observation of Cross-Sectional Microstructure at Soft Metal Interface with FIB Technology | ||