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| Session 2: Soldering Technology | ||||
| Location: Executive Salon 4 (Crowne Plaza Riverwalk San Antonio) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session focuses on the diverse aspects of soldering technology involving various structural and electronic applications. The new solder alloy joint made from Tin-Silver-Copper-X for high temperature uses will be introduced, and the fragility of SnAgCu (SAC) solder joints will be discussed. Presentations will cover the effects of Au content on structure and properties of Pb-Sn and Sn-Ag-Cu solder joints, soldering of zinc coated steel and steel/aluminum joints, and the benefits of nitrogen atmospheres in wave soldering. | ||||
| Session Chair: | Dr. Ronald W. Smith Materials Resources International, Lansdale, PA | |||
| 10:00 AM | BSC2.1 | Beneficial Alloy Effects in Tin-Silver-Copper-X Solder Joints for High Temperature Applications | ||
| 10:20 AM | BSC2.2 | Evaluation of the Effects of Au Content on Intermetallic Compound Layer Growth in Pb-Sn and Sn-Ag-Cu Solder Joints* | ||
| 10:40 AM | BSC2.3 | Low Temperature Brazing of Zinc Coated Steel and Steel/Aluminum Joints by Setting ZnAl-Alloys as Brazing Material | ||
| 11:00 AM | BSC2.4 | Maximising the Benefits of Nitrogen Inerting in Wave Soldering | ||