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The development of sapphire-based sensors is growing in demand due to their appealing characteristics that could withstand high temperatures and harsh operating conditions. However, the joining process of sapphire to other materials, especially for metals, is difficult to achieve due to dissimilar physical and chemical properties. Therefore in this study, a porous interlayer was introduced when brazing sapphire to Inconel 600. The interlayer consists of porous copper (Cu) and porous nickel (Ni) which was rolled together to the thickness of 0.4 mm. This porous Cu/Ni interlayer was placed in the between of sapphire, filler metal and Inconel 600. The brazing process was carried out using a eutectic filler metal containing Ti. The interface of brazed region/sapphire and brazed region/Inconel 600 were observed by an electron microscope followed by elemental analysis using SEM-EDS. The analysis has shown that there is no reaction layer at brazed region/sapphire interface. While a non uniform of reaction layer was formed at brazed region/Inconel 600 interface. It is believed that the formation of reaction layer is influenced by thermodynamic activity of Ti during brazing process.