Press Fit/Pressure-Soldered-Joint

Elementary pressure bondings for force fit bondings are commonly used and simply produced for joining of shafts and hubs. Pressure soldering bondings are generated by force fitting of the hub in the shaft, if at least one joining surface is coated with a 5 µm thick solder layer, e. g. Cu- or Zn-layer. There is no heat necessary for bonding these two parts. The formation of the joint is realized in solid state.

 Due to the combination of the pressure bonding with a pressure soldering bonding, the transmission capacity can be increased up to 350 %. Additionally, this combined pressure-pressure-soldering bonding is able to enhance its properties during its operation due to energy input, e. g. mechanical energy, heat.

In the presentation, the physical effects of the joint formation, the resulting properties of the bonding as well as facilities for the production of these pressure-pressure-soldering bonding suitable for industrial use, will be presented.