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Lead Free Solders - Session 2

Tuesday, April 24, 2012: 1:30 PM-3:10 PM
Red Rock B (Red Rock Casino Resort and Spa)
Session Chair:
Dr. Hui Zhao
1:30 PM
Interfacial Reactions Between Lead Free Solder Alloys and Metallic Substrates: Thermodynamics and Kinetics
Prof. Fiqiri Hodaj, Grenoble Institute of Technology
1:50 PM
Investigation of Cu6Sn5 Grain Orientations in Sn3.0Ag0.5Cu Lead-Free Solder Joints on Cu Sigle Crystal Substrates
Dr. Yanhong Tian, Harbin Institute of Technology
2:10 PM
Nanoindentation for Measuring Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders
Mr. Muhammad Sadiq, Georgia Institute of Technology; Dr. Jean-Sebastien Lecomte, LEM3 Arts et Métiers Paris-Tech; Dr. Mohammed Cherkaoui, Georgia Institute of Technology
2:30 PM
The Effect of Cu Content on Performance of SnAgCuNiBi /Cu Soldering
Ms. Fenglian Sun, Harbin University of Science and Technology; Yang Liu, Harbin University of Science and Technology; Yang Wang, Harbin University of Science and Technology
2:50 PM
The Microstructure and Mechanical Properties of Sn-58Bi Eutectic Alloy Wires
Mr. Long Zhengyi, Zhejiang Asia-General Soldering & Brazing Material Co., Ltd; Gu Xiaolong, Zhejiang Asia-General Soldering & Brazing Material Co., Ltd; Mr. Liu Ping, Zhejiang Asia-General Soldering & Brazing Material Co., Ltd; Jin Xia, Zhejiang Asia-General Soldering & Brazing Material Co., Ltd; Zhang Yu, Zhejiang Asia-General Soldering & Brazing Material Co., Ltd
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