Highly Conductive and Formable Copper Alloys
In response to the challenge for new electronic materials, Materion – Performance Alloys & Composites has developed a new series of copper alloys, QMet™, that feature excellent formability with increased conductivity, while maintaining high strength levels. This paper presents the development of Alloy QMet™ 300, a Cu-Cr-Ag base alloy with high conductivity (80%IACS) and highly desirable bend formability (0/0 MBR/t both ways), while achieving a nominal yield strength of 75 KSI.
QMet™ 300 strip alloy described herein is lean (99+% Cu) and depends on unique thermal-mechanical processing to keep grain and precipitate sizes small; so that conductivity and formability are simultaneously maintained. The microstructural evolution of QMet™300 will be discussed in detail, and key connector properties of QMet™300 will be compared to other available copper alloys.
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