JASM XXII: Soldering, Brazing and Solid State Joining

Monday, September 30, 2024: 10:30 AM-11:50 AM
22 (Huntington Convention Center)
Dr. Xun Liu, The Ohio State University and Prof. C R Kao, National Taiwan University
10:30 AM
Low Temperature Solders for Electronics Packaging Applications
Prof. C R Kao, National Taiwan University
10:50 AM
Interfacial Study of the Bonding between Low Melting Temperature Solder Alloy Nanoparticles and Textile Materials
Dr. Edward Fratto, University of Massachusetts Lowell; Mr. Andrew Chapman, University of Massachusetts Lowell; Prof. Zhiyong Gu, University of Massachusetts Lowell
11:10 AM
Ultrasonically assisted resistance welding of multilayer thin films-to-tab for battery cell manufacturing
Dr. Xun Liu, The Ohio State University; Mr. Ho kwon, The Ohio State University; Mr. Taosif Alam, The Ohio State University; Teresa Rinker, University of Michigan; Dr. Wayne Cai, General Motor R&D
11:30 AM
Sustainable Thermoplastic Rubber Adhesive for Enhanced Adhesion and Corrosion Resistance
Dr. Zeyang Yu, Oak Ridge National Laboratory; Dr. Nihal S. Kanbargi, Oak Ridge National Laboratory; Dr. Yong Chae Lim, Oak Ridge National Laboratory; Dr. Jiheon Jun, Oak Ridge National Laboratory; Dr. Sumit Gupta, Oak Ridge National Laboratory; Dr. Christopher C. Bowland, Oak Ridge National Laboratory; Dr. Zhili Feng, Oak Ridge National Laboratory; Dr. Amit K. Naskar, Oak Ridge National Laboratory
See more of: Joining of Advance and Specialty Materials (JASM XXII)
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