Microelectronic Failure Analysis
Microelectronic Failure Analysis
Wednesday, October 22, 2025: 1:40 PM
Failure Analysis is performed on many different materials and across many different industries. One such industry is Microelectronic Devices. While the Failure Analysis tools used overlap a lot of other industries (SEM, FIB, TEM, etc.), the functionality of Microelectronic Devices differ enough for there to be a specific ASM affiliate, Electronic Device Failure Analysis Society (EDFAS). This tutorial is a broad overview of some of the categories covered within EDFAS. Microelectronic Failure Analysis presents these various categories and Failure Analysis of Microelectronic Devices. In general, the failures are electrical in nature; however, the analysis results are physical in nature (ie. materials or structural). How Failure Analysis is used across the entire product cycle, from research to manufacturing to product support, is summarized. Particular attention is given to Microprocessors.