The Truth About FIBing
The early development of FIB was driven by critical applications such as circuit editing, transmission electron microscopy (TEM) sample preparation, and mask repair—each of which provided compelling value to researchers and engineers. As demand grew, both startups and established corporations entered the FIB market, spurring innovation. Over time, this activity led to consolidation and the eventual commoditization of the technology, as it matured into a widely available and reliable tool.
At the core of most FIB systems is the liquid metal ion source (LMIS), typically gallium, chosen for its low melting point and moderate atomic mass, which allows for efficient yet precise material removal. In applications where gallium may contaminate the sample - such as photomask repair - gas field ion sources (GFIS) were introduced. Originally developed for niche use cases, GFIS technologies have expanded to support mesoscale milling and now complement gallium-based systems.
FIB has profoundly influenced nanoscale materials characterization and analysis. It revolutionized TEM sample preparation by dramatically improving both speed and precision. Circuit editing—modifying an integrated circuit post-fabrication—was an early and powerful driver of FIB development due to its strategic value in chip debugging and validation. In photomask repair, FIB extended the usability of costly masks by removing defects, increasing yield, and reducing production costs. Additionally, FIB plays a critical role in preparing needle-shaped samples for Atom Probe Tomography (APT), enabling atomic-scale compositional analysis.
Today, FIB systems are integral to most advanced analytical labs and support R&D and manufacturing in semiconductors, materials science, and life sciences.