Soldering, Brazing and Diffusion Bonding and after break Measurement, Simulation and Control of Joining I

Wednesday, October 22, 2025: 1:00 PM-3:00 PM
1:00 PM
Low-Melting Temperature Nano-Solder Enhanced E-Textile Sensors for Simultaneous Detection of Multiple Hazardous Gases
Mr. (Daniel) Chuqing Liu, University of Massachusetts Lowell; Mr. Ileas Harb, University of Massachusetts Lowell; Dr. Edward Fratto, University of Massachusetts Lowell; Prof. Zhiyong Gu, University of Massachusetts Lowell
1:20 PM
Multi-Principal Element Alloys Developed for Brazing of Ni-base Superalloys
Dr. Zhenzhen Yu, Colorado School of Mines; Dr. Benjamin T. Schneiderman, Colorado School of Mines; Mr. Aric Adamson, Colorado School of Mines; Mr. Aaron Wells, Colorado School of Mines
1:40 PM
Study of Adhesive Deformation at Bonding Interface between CFRP and AHSS by Micro Digital Image Correlation Technique
Dr. Yong Chae Lim, Oak Ridge National Laboratory; Dr. Jian Chen, Oak Ridge National Laboratory; Dr. Zhili Feng, Oak Ridge National Laboratory
2:00 PM
Surfactant-Assisted Synthesis of Bismuth-Based Nanoflowers and their Applications as Electrochemical Sensors
Dr. Edward Fratto, University of Massachusetts Lowell; Ms. Cuilei Li, University of Massachusetts Lowell; Dr. Zhengyang Yang, University of Massachusetts Lowell; Ms. Mary Joens, University of Massachusetts Lowell; Mr. Matthew Von Boecklin, University of Massachusetts Lowell; Mr. Andrew Chapman, University of Massachusetts Lowell; Prof. Zhiyong Gu, University of Massachusetts Lowell
2:20 PM
Determining Heat Treatment Effects on the TCR of NiCr thin film sensors
Mr. Hashem Almomani, Center for Advanced Material Joining
2:40 PM
In 2025, PVA TePla AG launched a new industry standard in Diffusion Bonding that “ups” tool processing efficiency, and “reduces” capital costs.
Mr. Thomas Palamides, PVA TePla America Inc.
See more of: Joining of Advance and Specialty Materials (JASM XXIV)
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