Enabling Data-Driven Material Development and Simulation Validation in Light-Metal Structures Using Accessible Full-Field Strain Measurement
This paper examines how recent advances in imaging sensors, data-transfer standards, and general-purpose computing have reduced the cost and complexity of full-field digital image correlation (DIC), enabling broader adoption in material development workflows. Improvements in global-shutter CMOS sensors, including high-resolution 1/1.8″ formats such as the Sony IMX547, combined with USB-C and USB 3 Gen 1/Gen 2 bandwidth and modern laptop-class computing, allow compact systems such as ARAMIS 1 to deliver high-quality full-field strain data without specialized acquisition hardware.
An industrial case study from an autonomous vehicle manufacturer is presented, where full-field optical measurement is used across both raw-material characterization and subassembly-level testing. With more than 500 distinct materials and alloys present in a single vehicle platform, the organization applies full-field strain measurement during incoming inspection and development testing to validate material behavior, improve consistency of material cards, and strengthen correlation between experimental results and finite-element simulations.
The results demonstrate that recent technological advances have made full-field strain measurement a practical tool for systematic material understanding, supporting more reliable simulation, reduced model uncertainty, and faster iteration in light-metal product development.
