Physics-based Thermal Conductivity Model Compatible with Multi-component CALPHAD Assessments

Thermal conductivity is a critical thermophysical property for materials used in semiconductor manufacturing applications such as wafer tables and packaging substrates. However, reliable thermal conductivity models for complex multicomponent alloys remain lacking, creating a challenge for reliably simulating thermal behavior in semiconductor manufacturing. In this work, we developed a physics-based model that links thermal conductivity to phase constitution and composition data provided by CALPHAD. This model has been validated in multiple unary and binary systems and predicts thermal conductivity across wide temperature and composition ranges by accounting for phase and composition effects. This model uses assessed thermodynamics and thermophysical properties from CALPHAD assessments, including heat capacity, molar volume, and magnetism, resulting in the ease of applicability to multi-component systems. This approach enables improved design and qualification of advanced materials for thermal management. This work was performed with funding from the CHIPS Metrology Program, part of CHIPS for America, National Institute of Standards and Technology, U.S. Department of Commerce.