Reports by Randal E. Mulder
A Simple FIB Method for Constructing Electrically Isolated Microprobe Pads for the Electrical Analysis of Failing 0.12um Technology SRAM Bit Cells
DuPont EKC265TM PERR as a Copper Metallization Etchant for the Physical Deprocessing of Failing 0.12um Technology Devices
Semiconductor Inter-Material Analysis using an FIB Sample Preparation Method and Auger Depth Profiling