B. Holdford
Texas Instruments
Dallas, TX Packaging |
C. Richardson
Abound Solar
Fort Collins, CO FIB Fault Isolation |
C. Furlong
Worcester Polytechnic Institute, WPI
Worcester, MA Fault Isolation FA Basics |
J. Griffin
Analog Devices
Norwood, MA Analog Device Failure Analysis |
J. A. Walraven
Sandia National Labs
Albuquerque, NM Microscopy Tools MEMS Devices |
K. S. Wills
Independent Consultant
Sugar Land, TX Yield, Test and Diagnostics FA Basics Packaging Yield |
L. G. Henry
ESD-TLP Consulting & Testing
Fremont,, CA Failure Mechanisms EOS/ESD |
R. Ring
SMSC Austin
Austin, TX Emerging Technologies Device and Memory FA |
S. Subramanian
Freescale Semiconductor, Inc.
Austin, TX Materials Characterization |
S. Li
Spansion Inc
Sunnyvale, CA Device and Memory FA |
T. Myers
ON Semiconductor
Gresham, OR Yield, Test and Diagnostics |
Z. Wang
Intel Corporation
Chandler, AZ Lead Free Packaging Packaging Lab Management |