Enhanced De-Packaging and Chip Access FA Techniques start from the basics of package Failure Analysis applicable to the novice Analyst. These basic techniques include, Manual Decapsulation, Jet Etching, Mechanical de-lidding, Lapping Techniques. From the basics, newly developed package analysis techniques will be discussed that are important to the experienced Analyst. The enhanced techniques: Top down Chip Access/Tape Pull, Silicon edge lap barrier, Dye'n Pry/Tape Pull combination, Cold Acid Bath for Underfill removal and QFP Backside Cavity Milling; along with the use of optical microscopy and SEM inspection, are critical to the fail mechanism identification of high pin count packages. BGA packages are targeted here as one of the package types that benefit substantially from the development of these new techniques. Detailed procedures of all techniques will be presented.