Packaging is frequently misunderstood and more often underestimated in its effect on product reliability. This presentation will briefly show some of the newest technologies and their advantages and/or disadvantages. The respective characteristics of the newest technologies – advanced packaging and stacked die – that prevent customer PFA and EFA will be presented. Techniques that can be employed to mitigate problems such as power-up isolation and partial EFA will be described. When these methodologies fail to give the required defect isolation with full electrical characterization, repackaging becomes a viable option. With a solid prelude, a detailed answer to “what is repackaging?” will be given. The benefits of repackaging will be provided in the form of case histories, ranging from testing using basic photon emission microscopy to complex debug applications. Concluding remark will lead the audience into the advantages and disadvantages of new developments in packaging and repackaging of the new technologies.