A. Falk
OptoMetrix, Inc
Renton, WA
Session 7: Photon Based Techniques I
 

B. Benware
Mentor Graphics
Wilsonville, OR
Session 13: Test
 

C. Kardach
DCG Systems Inc
Fremont, CA
Session 16: Yield Enhancement
 

D. J. Bodoh
Freescale Semiconductor
Austin, TX
Session 1: Emerging Concepts
 

D. Burgess
Accelerated Analysis
Half Moon Bay, CA
Session 3: Failure Analysis Process I
Session 17: Failure Analysis Process II
 

D. Goyal
Intel Corporation
Chandler, AZ
Session 2: Package and Assembly Level FA I
Session 4: Package and Assembly Level FA II
 

E. Raz-Moyal
Gatan
CA
Session 6: Sample Preparation I
Session 12: Sample Preparation II
 

F. Beaudoin
IBM

Session 9: Photon Based Techniques II
 

J. J. Demarest
IBM
Albany, NY
Session 11: System Level Failure Analysis
 

J. Teshima
FEI Company
Hillsboro, OR
Session 18: Metrology
 

J. Hartsell
Dell Inc.
ROUND ROCK, TX
Session 11: System Level Failure Analysis
 

J. Russell
Inotera
Taoyuan, Taiwan
Session 18: Metrology
 

K. (. Hooghan
FEI KAUST
Saudi Arabia
Session 5: Circuit-Edit
 

M. Bruce
Independant
TX
Session 1: Emerging Concepts
 

P. Kaszuba
IBM Microelectronics
Essex Junction, VT
Session 8: Scanned Probe Microscopy
 

P. Perdu
CNES - French Space Agency
Toulouse, France
Session 9: Photon Based Techniques II
 

R. Chanpura
Texas Instruments
Stafford, TX
Session 10: Posters
 

S. Gunturi
Texas Instruments, Inc.
Dallas, TX
Session 16: Yield Enhancement
 

S. Wills
Independent Consultant
Sugar Land, TX
Session 10: Posters
Session 14: Photon Based Techniques III
 

S. Blanton
Carnegie Mellon University
Pittsburgh, PA
Session 13: Test
 

S. Decker
South Dakota School of Mines
Rapid City, SD
Session 15: Nanoprobing
 

S. Ippolito
IBM
Yorktown Heights, NY
Session 7: Photon Based Techniques I
Session 14: Photon Based Techniques III
 

S. Herschbein
IBM Systems & Technology
Hopewell Junction, NY
Session 5: Circuit-Edit
 

T. Cavanah
DCG Systems, Inc
TX
Session 15: Nanoprobing
 

T. Kane
IBM
Hopewell Junction, NY
Session 8: Scanned Probe Microscopy
 

Z. Fu
Intel Corporation
Chandler, AZ
Session 2: Package and Assembly Level FA I
Session 4: Package and Assembly Level FA II
 

Z. Wang
Intel Corporation
Chandler, AZ
User Groups