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Wednesday, May 17, 2006 - 10:00 AM
APP1.4

Thermal Spray Joining - Soldering and Filling of Aluminium Substrates under Atmospheric Conditions by a Combined Thermal Spray / Fusing Technique

B. Drößler, K. Möhwald, Institute of Materials Science, Garbsen, Germany; F. W. Bach, Leibniz Universität Hannover, Garbsen, Germany; D. Kolar, Leibniz Universität Hannover, Witten, Germany

Thermal spraying for joining and filling of aluminium substrates at atmospheric conditions represents an enrichment in soldering. During a two-stage process rod-, wire- or cored wire type, zinc based spraying materials are applied for joining or filling areas of the substrate and get remolten afterwards. The advantages, in contrast to soldering, result from the direct application of spray material, in particular also in positions of constraint, and an uncomplicated processing, which enables a conditioned inline capability and the use as a relatively simple procedure for construction-site services. The aluminium substrate surface and spraying material passivation, which would prevent a successful remelting, can be effectively suppressed by the use of fluxing agents –either on the substrate or in cored wires– as well as a brushing activation.

Summary: Thermal spraying for joining and filling of aluminum substrates under atmospheric conditions represents an enrichment in soldering technology. In a respective process rod-, wire- or cored wire type, zinc-aluminum based spray materials are applied for joining components or substrate area filling and fused simultaneously. The advantages, in contrast to soldering, result from the direct application of spray material, in particular also in constraint positions, and an uncomplex processing, which enables a conditioned inline capability and the use as a comparatively simple procedure for construction-site services or repairs.