Home      Exposition      To Register      ASM Homepage
Back to "Properties, Characterization and Testing Poster Session" Search
  Back to "Poster Session" Search  Back to Main Search

Monday, May 14, 2007

Properties of Copper Coatings Deposited by Multi-Function Micro-Plasma Spraying

G. Liu, Xi'an Hi-Tech Research Institute, Xi'an, China; L. Wang, Xi'an Research Institute of Hi-Tech, Xi'an, NM, China; H. Wang, S. Hua, Xi'an Research Institute of Hi-Tech, Xi’an, China

In this paper, copper coatings is acquired on a metallic substrate by means of an multi-function micro-plasma spraying under different processing parameters. The microstructure and phase structure of Copper coatings were investigated using scanning electronic microscope and X-ray diffraction, bonding strength were tested by electron tensile tester, droplet impinging and flattening on a flat substrate surface and the residual stress after solidification are studied numerically. The experiment results show that the density of Copper coatings was improved with the current of the plasma power and operating gas flow increasing, and this copper coating possesses high adhesion strength and low residual stress, still without obvious oxidation.

Summary: In this paper, copper coatings is acquired on a metallic substrate by means of an multi-function micro-plasma spraying under different processing parameters. The microstructure and phase structure of Copper coatings were investigated using scanning electronic microscope and X-ray diffraction, bonding strength were tested by electron tensile tester, droplet impinging and flattening on a flat substrate surface and the residual stress after solidification are studied numerically. The experiment results show that the density of Copper coatings was improved with the current of the plasma power and operating gas flow increasing, and this copper coating possesses high adhesion strength and low residual stress, still without obvious oxidation.