H. Choi, K. Kim , T. Kim , Sungkyunkwan University, Suwon, South Korea; H. Choi, Samsung Electro Mechanics Corporation, Suwon, South Korea
To apply powder spray process to the manufacturing of electronic components, it is necessary that the process should be performed at low temperature and atmospheric pressure conditions for better integration and lower cost. In this paper, we developed a powder spray process which operates at atmospheric pressure and low temperature and enables a highly functional film to be formed onto any type of substrate using metal or non metal powders. Film formation depends on several parameters including the distance between nozzle exit and substrate, exit gas velocity, spray time and particle diameter. We studied on film properties such as thickness and area as a function of these parameters. Moreover theoretical calculation on particle motion during film formation was performed and compared with experimental results.
