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| Thermal Spray Metallic Coatings for Use in Semiconductor Defect Reduction and Electronic Interconnects | ||||
| Location: Laughlin III (Flamingo Las Vegas Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Dr. Robert Gansert AMTS Incorporated, Simi Valley, CA | |||
| 3:40 PM | Defect Reduction in Semiconductor Equipment by Thermal Spray | |||
| 4:00 PM | Parameters Affecting Bond Strength and Surface Roughness in Twin Wire Arc Spray Aluminum Coatings | |||
| 4:20 PM | Influence of Powder Size in Aluminum Oxide Coatings for Use in the Semiconductor Industry | |||
| 4:40 PM | Direct Write of Antenna Aperstructures and Electronic Interconnects Using Kinetic MetallizationTM | |||