International Thermal Spray Conference (ITSC) 2009 (May 4-7, 2009): Plasma Sprayed Ceramics in Semiconductor Equipment and Electronics Applications

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Plasma Sprayed Ceramics in Semiconductor Equipment and Electronics Applications

Tuesday, May 5, 2009: 10:30 AM-12:10 PM
Laughlin III (Flamingo Las Vegas Hotel)
Session Chair:
Dr. Hong Shih
10:30 AM
Electrochemical Corrosion Evaluation of Thermal Spray Coatings Used as Environmental Barrier
Mr. Leo Glass, APS Materials; Heath Phillips, APS Materials
10:50 AM
Influence of Powder Properties and Plasma Spray Conditions on Erosion Resistance of Yttrium Oxide Coatings against Halogen Plasma for Dry Etching Process in Semiconductor and Electronic Applications
Mr. Hiroyuki Ibe, Fujimi Incorporated; Mr. Kazuto Sato, Fujimi Incorporated; Ms. Fumi Yuasa, Fujimi Incorporated; Mr. Hiroaki Mizuno, Fujimi Incorporated; Dr. Junya Kitamura, Fujimi Incorporated
11:10 AM
Bond Strength and Bond Strength and Interfacial Effects of Plasma-Sprayed Yttria on Anodized Aluminum
Dr. Christopher Petorak, Praxair Electronics
11:30 AM
Microstructure Evolution and Dielectric Properties of Plasma Sprayed BaTiO3 Coatings
Prof. Kyeong Ho Baik, Chungnam National University; Ms. Young-Mi Kim, Chungnam National University; Mr. Kwang-Seo Park, Dansung Electron
11:50 AM
Induction Plasma Spraying of High Purity Materials for the Electronic Industry
Dr. Maher Boulos, Tekna Plasma Systems Inc.
12:10 PM
Panel Discussion
12:30 PM
Lunch
See more of: Electronic and Semiconductor Applications
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