International Thermal Spray Conference (ITSC) 2009 (May 4-7, 2009): New Equipment and Technologies: Very Low Pressure Plasma Spraying (VLPPS) - I
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New Equipment and Technologies: Very Low Pressure Plasma Spraying (VLPPS) - I

Monday, May 4, 2009: 1:50 PM-3:40 PM
Laughlin II (Flamingo Las Vegas Hotel)
Session Chairs:
Dr. Aaron C. Hall and Prof. Pierre Fauchais
1:50 PM
Low Pressure Plasma Spray – Thin Film ® at Sandia National Laboratories
Dr. Aaron C. Hall, Sandia National Laboratories; Nicholas R. Spinhirne, New Mexico Institue of Mining and Technology; Dr. Deidre A. Hirschfeld, New Mexico Institue of Mining and Technology; James F. Mccloskey, Sandia National Laboratories; David A. Urrea, Sandia National Laboratories; Mr. Timothy J. Roemer, Ketch Corporation; David E. Beatty, Ketch Corporation
2:10 PM
Vapor Phase Deposition Using LPPS Thin Film
Dr. Konstantin von Niessen, Sulzer Metco AG, Switzerland; Dr. Malko Gindrat, Sulzer Metco AG, Switzerland; Dr. Arno Refke, Sulzer Metco AG, Switzerland
2:30 PM
LPPS-Thin Film Process; Overview of Origin and Future Possibilities
Mr. Erich Muehlberger, Sulzer-Metco; Mr. Philip J. Meyer, Sulzer-Metco
2:50 PM
On the Use of Low-Pressure Plasma Spraying Equipment to Produce Thin Films and Thick Coatings Using Liquid and Gaseous Precursors
Dr. Philippe Guittienne, Ecole Polytechnique Fédérale de Lausanne; Dr. Christoph Hollenstein, Ecole Polytechnique Fédérale de Lausanne; Dr. Jean-Luc Dorier, Ecole Polytechnique Fédérale de Lausanne; Dr. Malko Gindrat, Sulzer Metco AG (Switzerland); Dr. Arno Refke, Sulzer Metco AG (Switzerland); Dr. Richard Schmid, Sulzer Metco AG (Switzerland)
3:10 PM
Break
See more of: Equipment, Processes, and Modeling
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