Cold Spray, Enabling Large Area Monolithic Sputtering Targets

Process economics continues to drive the sputtering community towards the use of increasingly larger substrates and correspondingly larger targets. For some sputter materials desired target size has already exceeded the maximum size that can be produced with conventional industrial processes or tooling. Meeting this challenge has required the use of assemblies of separate segmented or tiled targets and having to deal with the attendant problems produced by these targets during the sputtering process. This paper will present the challenges encountered, the results of the modeling and the experimental work conducted to overcome those challenges in the effort to manufacture a Generation 7 monolithic sputtering target in excess of 2.80 meters by 2.50 meters