Advancement in Thermal Spray Coatings for Semiconductor Tools

Semiconductor process chambers use several components in the plasma zone, where they are exposed to corrosion under aggressive chemistries along with high voltages and elevated temperatures.  Thermal spray technology continues to offer several coatings that can provide protection to these chamber components for specific applications. These coatings are also capable of offering wet cleaning protection beyond resistance against dry etch conditions.  The surface properties of chamber liners and other components can be altered by using coatings to resist plasma erosion and reduce particle generation. Thermal spray coatings are also used for electrostatic chucks. These coatings provide dielectric protection and rapid means of clamping and release of working substrates from electrostatic chucks. One unique advantage of dielectric coatings is anti-arc coverage of critical areas on the electrostatic chucks and chamber components. Thermal sprayed coatings are also getting acceptance as means of extending the life of sintered ceramic components.

Examples of electrostatic chucks and chamber components protected by advancements in thermal sprayed coatings shall be presented.