The Cu nanoparticles formation in Sn substrate by cold gas dynamic spray

Monday, May 7, 2018
Exhibit Halls A-E (Gaylord Palms Resort )
Prof. K. H. Ko , Ajou university, Suwon, Korea, Republic of (South)
Prof. B. Ahn , Ajou university, Suwon, Korea, Republic of (South)
Dr. S. -H. Jung , Agency for Defense Development, Daejeon, Korea, Republic of (South)
Mr. J. S. Park , Ajou university, Suwon, Korea, Republic of (South)
Dr. H. Lee , Ajou university, Suwon, Korea, Republic of (South)
The interfaces between the cold-sprayed Cu particles and the Sn substrates were investigated by TEM analysis. Due to the high velocity collisions of relatively hard Cu particles, the intermetallic layers (Cu6Sn5) were found at the interfaces without annealing. And also, it was observed that the Cu nanoparticles from cold sprayed Cu particles were formed in Sn substrate. For the dynamic interaction at the interfaces, it could be considered that Cu nanoparticles formation by cold spray at the interfaces were resulted from the high velocity impact (the kinetic energy (mechanical energy) > the nanoparticle recrystallization). 1
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