How Laser Cladding combined with thermal spray technologies improve yield and particle performances in latest semiconductor PVD production chambers

Semiconductor industry is always driven to develop processes that enable dies size reduction as well as production efficiency improvement. In this context, PVD processes represent one of the major challenges in the wafer manufacturing chain. To reduce particle level, the most used and efficient way is to develop the surface area of the vacuum chambers components. To do so, two processes are commonly used: applying a metallic thermal sprayed coating or developing the surface area by an electron beam onto the chamber components walls. These methods have several drawbacks such as abnormal growth of particles or limited parts life time.

Cleanpart has developed an innovative architecture based on Laser Cladding crossed with thermal spray technologies. Applied on the chamber components to develop their surface, this texture acts as particles trap and therefore exhibits several advantages: the parts have longer life time, the applied texture is more homogeneous, has a drastically higher developed surface area…

This process has been advantageously qualified in the manufacturing chain by major actors in the semiconductor field on sub 20nm and older technology products, and is now implemented in production. It has proven to significantly increase preventive maintenance intervals, lower particle level and enhance yield.