Adhesion and interface of aluminum and copper coating formed on ceramic substrate by low-pressure cold spray

Although it has been studied to form a conductive coating on ceramic substrates using cold spray, the mechanism of adhesion between the ceramic substrate and the metal coating is not sufficiently clarified. We have worked on elucidating the adhesion mechanism by forming coating of Al and Cu on Al₂O₃, AlN ceramic substrate respectively. In this study, the adhesion strength test and the analysis was performed by TEM, STEM, and EDS at the metal/ceramic interface. As a result, it was suggested that the oxide layer exists at the metal/ceramic interface, and it is one of the bonding elements.