Micrwoave plasma spraying for low resistivity Cu deposition onto resin substrate

Coating of metal materials onto resin substrate is difficult for conventional thermal spraying techniques due to its high heat load to the substrate. However, low power microwave plasma spraying is possible to achieve spraying of metal at less than 1kW of input power under atmospheric pressure condition. In this study, fabrication of low resistivity Cu coating onto polyacetal substrate was investigated for direct printing of electric circuit onto the substrate. Furthermore, the deposition process of molten metal particle onto the substrate was investigated.