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Tuesday, October 19, 2004 - 3:00 PM
FUEL 5.3

Clad Metal by Roll Bonding for SOFC Interconnects

L. Chen, B. Jha, Engineered Materials Solutions, Inc., Attleboro, MA; Z. G. Yang, G. G. Xia, J. W. Stevenson, Pacific Northwest National Laboratory, Richland, WA

Metallic SOFC interconnects have been studied in recent development in solid oxide fuel cells (SOFC). Currently, no single existing alloy can meet all the requirements for SOFC interconnects. The dual environments of an interconnect, that is oxidizing environment at cathode side and reducing environment at anode side, have to be addressed through oxidation resistance and corrosion resistance with other requirements including low thermal expansion, oxide scale conductivity, thermal stability and compatibility with other stack components. Clad metal, a layered composite material, has been considered as a candidate to tackle such issues, as it is traditionally used in industries by providing solutions in both functionality and cost effectiveness. It is thought clad metal can combine merits and overcome shortfalls of different individual alloys or alloy groups for such specific applications. Clad metal can be produced economically by roll bonding, a well-established, environment-friendly manufacturing process. A general review is given in roll bonding technologies and clad metal applications. The clad design methodology for SOFC interconnects is discussed with the concerns of coefficient of thermal expansion, oxidation resistance, diffusion and microstructural stability as well as cost. The mechanical and thermal properties as well as short term surface stability are examined from the preliminary studies on Ni-based superalloy clad over high chromium ferritic stainless steel.


Summary: Metallic interconnects have been studied in recent development in SOFC. Clad metal, a layered composite material made by roll-bonding technologies, has been considered as a candidate for such applications by combining merits and overcoming shortfalls of different existing alloys. This paper presents this developing effort.