Biaxial texture in metallic substrates is a necessary parameter for processing high Jc YBa2Cu3O7-d thin film coated conductors. The nonmagnetic and highly conductive nature of copper makes it a preferable substrate when electrically connected to the high temperature superconducting (HTS) layer of HTS coated conductors. However, the low mechanical strength of copper limits its application. Textured copper alloy substrates may potentially alleviate this problem. In our work, highly textured copper and copper alloy substrate tapes were produced using the rolling-assisted biaxially textured substrate (RABiTS) process. This technique, which incorporates heavy cold rolling and subsequent recrystallization, resulted in excellent biaxial alignment of the Cu and Cu-alloy. XRD Phi and Psi scans indicate in-plane and out-of-plane full width half maximum values of 5.4им and 5.8им for the Cu and 4.7им and 5.9им for the Cu-alloy. The presentation will include results from orientation imaging microscopy (OIM) Orientation Imaging Microscopy analysis as well as preliminary results from the deposition of buffers layers and the subsequent YBCO film.