Tungsten/copper composites are widely used as heavy-duty electrical contactors and discharging electrodes. P/M methods, such as liquid copper infiltration into a porous-sintered tungsten skeleton, are normally used for producing the bulk components. In a previous study, it was suggested that, using laser cladding technique, components surface-coated with W/Cu composites might be more effective and economical, and the feasibility of fabricating relatively thin (about 1-1.5 mm) dense W/Cu coatings was studied. For some application cases, however, coatings thicker than 2 mm may be necessary. In the present contribution, ways are explored to deposit thick W/Cu overlays that are metallurgically dense and uniform. It was found that W and Cu separate after reaching certain coating thickness, making the fabrication difficult. This technical challenge is overcome by adjusting the processing parameters, by modifying the composition of powder blends and by depositing functionally gradient coatings. Furthermore, microstructures of the coatings are investigated using SEM, EDS/WDS and XRD, and properties (like CTE and micro-hardness) are also evaluated.