Quantitative Analysis of Complex Microstresses created by Advanced Manufacturing using X-Ray Diffraction

A variety of manufacturing processes, including novel and disruptive methods such as Additive Manufacturing, frequently yield samples with complex, often metastable features that are difficult to characterize. X-ray scattering data not only reveals the crystal structure but also allows the quantification of crystallographic defects, including dislocations, radiation-induced damage, grain and sub-grain boundaries, as well as twinning and stacking faults. These defects, collectively known as the microstructure, strongly influence the mechanical properties of materials.
This presentation will examine the capabilities of whole-pattern Diffraction Line Profile Analysis (DLPA), a modern approach to microstructure characterization based on first-principle physical models. It will outline a synchrotron-based X-ray technique that enables precise spatial mapping of defect populations in specimens where these characteristics vary by location, e.g., welded materials. Furthermore, the lecture will address the spatial variation of dislocation structures observed in as-printed Additively Manufactured materials.