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Monday, August 1, 2005 - 11:00 AM
SES .5

Spontaneous Electrochemical Deposition of Copper from Organic Solutions on TaSiN

J. Li, S. You, M. J. O'Keefe, T. J. O'Keefe, University of Missouri-Rolla, Rolla, MO

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Summary: Uniform and high density Cu crystals were spontaneously deposited from organic solution on TaSiN barrier layers as the catalytic seeds for the subsequent electroless Cu coating. The organic media used for seeding are strong polarizing and low conductive organic solutions. The mechanism is based on electrochemical displacement reaction.