Ti_48.5Ni_18.0Cu_33.5 films were prepared with a carrousel-type multiple-source sputtering apparatus. The films peeled off glass substrates were annealed either at 773, 873 or 973K for 1h to achieve crystallization. The microstructures of the annealed films were analyzed by X-ray diffraction, electron diffraction, conventional and high-resolution transmission electron micrography. From these results, the precipitates within a TiNi(B2) grain in the film annealed at 773K were identified to be a TiCu phase(B11). This phase was also identified in the form of grain-boundary precipitates for the same film. The grain size of a film annealed at 773K was about 500nm and increased slightly with increasing annealing temperature. In the films annealed at 873 and 973K no precipitates were observed within TiNi grains, but many grain-boundary precipitates of a TiCu phase were observed. To investigate the shape memory behavior of the annealed films, strain-temperature measurements under various constant stresses were carried out for films annealed at 873 and 973K but a film annealed at 773K, since the film annealed at 773K for 1h was brittle. Their strain-temperature curves showed a single-step deformation associated with the B2 to B19 transformation. The critical stresses for inducing plastic deformation were 640 and 800MPa for the films annealed at 973 and 873K, respectively, and the maximum recoverable strains were 0.98 and 0.67%, respectively. It was found that, compared with those of Ti-Ni-Cu films with less than 30at.% Cu, these critical stresses were greatly high and the recoverable maximum strains were considerably small. The martensitic transformation start temperatures under zero stress, obtained by extrapolation to zero stress, were 336 and 327K for the films annealed at 973 and 873K, respectively. The temperature hysteresis at 120MPa of the film annealed at 973K was 13K and increased to 19K with decreasing annealing temperature to 873K.