We have investigated the effect of Pd content on the shape memory behavior of Fe-Pd alloy films. Fe-Pd films with various Pd contents (28.5~31.0at%) were deposited onto (001)Si wafers with thermal oxide layer using a dual-source dc magnetron sputtering apparatus, and they were annealed at 1173K for 60 min followed by iced water quenching. In order to characterize the shape memory behavior, thermal cycling tests were performed under various constant stresses. For this purpose, free-standing specimens were prepared by chemically dissolving the Si substrates. Temperature-strain curves obtained from thermal cycling tests indicated that all annealed Fe-Pd films in this work showed shape memory effect. The Ms temperature increases with increasing applied constant stress, obeying the Clasius-Clapeyron law. The Ms temperature without stress was found to be ~330K for Fe-28.5%Pd film, and it decreases linearly down to ~210K with increasing the Pd content up to 31at%. Maximum recoverable strain was nearly constant at 0.7% when the Pd content is 29~30.2at%. Critical stress against plastic deformation was measured to be 300MPa for the films containing 29.9at%Pd. However, that of the films containing 29.2at%Pd was as low as 40 MPa. This drastic decrease in critical stress with decreasing Pd content should be caused by the appearance of irreversible fct->bct transformation in lower Pd content films. It should be noted that the films with fct->bct transformation also showed perfect shape memory behavior after an appropriate training.