Production and processing II

Tuesday, May 17, 2022: 10:30 AM-12:15 PM
Carlsbad A&B (Westin Carlsbad Resort)
Dr. Alberto Coda, SAES Getters S.p.A. and Dr. Marcus L. Young, University of North Texas
10:30 AM
The Influence of Ingot Transformation Temperatures on Plateau Strain and Stress of Nitinol Tubes
Mr. Andreas Keck, G.RAU GmbH & Co. KG; Mrs. Katarzyna Plaskonka-Weisenburger, G.RAU GmbH & Co. KG; Dr. Jochen Ulmer, EUROFLEX GmbH; Dr. Alan R. Pelton, G.RAU Inc.; Mr. Sean M. Pelton, G.RAU Inc.
10:45 AM
Influence of femtosecond laser beam polarization on cutting thick-walled Nitinol tubing
Mr. Martin Stampfl, Coherent Inc.; Mr. Kay Ole Schmid, Coherent Inc.; Mr. Roland Wölzlein, Coherent Inc.
11:00 AM
Hot Forming of Nitinol: Fundamental Investigations and Applications
Mr. Stefan Zende, ADMEDES GmbH; Mr. Moritz Pohler, ADMEDES GmbH; Mr. Lucas Bittigkoffer, ADMEDES GmbH; Dr. Nils-Agne Feth, ADMEDES GmbH
11:15 AM
Effect of Flash Annealing on the Microstructure and Fatigue Life of a Ni-rich NiTi-20 at.% Hf High Temperature Shape Memory Alloy
Ms. Faith Gantz, University of North Texas; Dr. Michael T. Wall, University of North Texas; Dr. Marcus L. Young, University of North Texas; Mr. Drew J Forbes, Fort Wayne Metals
11:30 AM
Manufacture and Processing of Large Nitinol Rings for Application in Seismic Dampers
Mr. Edward Mild, M.S., Fort Wayne Metals; Dr. Darel E. Hodgson, Ph.D., Nitinol Technology; Dr. Mohammad Salehi, Ph.D., Rice University; Dr. T. Kim Parnell, Ph.D., P.E., Parnell Engineering & Consulting; Prof. Reginald DesRoches, Ph.D., Rice University
11:45 AM
Melt Spun NiTiHf Ribbons for High Temperature Actuation Applications
Dr. Jak Li, Smarter Alloys; Mr. Siu Kei Tang, Smarter Alloys; Dr. Michael L Kuntz, Smarter Alloys; Dr. Mohammad Ibraheem Khan, Smarter Alloys
12:00 PM
SHAPE: Shape memory alloys via halide-activated pack equilibration
Prof. David W. Lipke, Missouri University of Science and Technology; Mr. Andrew S. King, Alfred University; Mr. Ryan D. Dempsey, Missouri University of Science and Technology
See more of: Technical Program
<< Previous Session | Next Session >>